TECHNOTUBES Project –AIXTRON Launches New BM 300T Carbon Nanotubes System

TECHNOTUBES Project –AIXTRON Launches New BM 300T Carbon Nanotubes System

Aachen, Germany, July 5, 2012 – AIXTRON SE announced the successful conclusion
of the European Commission-funded “TECHNOTUBES” (Technology for Wafer-Scale
Carbon Nanotubes) project, with a demonstration of its new automated growth equipment,
BM 300T.

The aim of the 3-year project was to develop growth processes, automated equipment,
quality control/monitoring and a variety of end-applications based on carbon nanotubes. The
members of the project consortium were the University of Cambridge (coordinator), ETH
Zurich, TU Denmark, TU Berlin, Fritz Haber Institute, CNR-Italy, Philips, THALES,
Cambridge CMOS Sensors, IMEC, and AIXTRON.

Prof. John Robertson, the project coordinator from the University of Cambridge, comments,
“This unique project brings together world-class partners from industry and research to
create a carbon nanotube value chain, from growth equipment to material production to
exploitable devices. The key applications that emerged from this project include
interconnects, thermal interface materials, medical and security X-ray sources, gas
detectors, biological probes, microfluidics and novel energy storage devices. We are grateful
to the European Commission for providing the funding which made this project possible.”

Dr. Ken Teo, Director of Nanoinstruments adds, “Our role at AIXTRON was to create a
system capable of depositing various carbon nanotube structures that met the requirements
of these applications. The challenge was to integrate various processes (single-wall, multiwall,
straight vertical nanotubes) into a single platform offering the uniformity, repeatability
and a high degree of automation that industrial production partners demand. The BM 300T
system we have developed successfully achieves these goals by enabling high throughput,
wafer-scale carbon nanotube production, incorporating thermal and plasma deposition,
precursor activation and a novel wafer loading and heating system.”